Electronics Gaskets, EMI Shielding, and Insulators
Cannon Gasket die-cuts materials from 0.001 inch film to 0.5 inch conductive foam under ISO 9001 systems with PSA backing and clean-room assembly. Send enclosure drawings, attenuation targets, and volume for material options, tooling cost, piece pricing, and lead time.
- Serving telecommunications, computing, consumer-electronics, and industrial-controls OEMs across prototype to high-volume runs.
- Used for EMI/RFI enclosure gaskets, display and LCD bezels, board-level shielding, insulation washers, dielectric films, and flex-circuit insulators.
- Fabricated from conductive silicone, metal mesh, fabric-over-foam, Mylar, Kapton, G-10 fiberglass, and Nomex paper stock.
Request a quote for Electronics projects.
Sealing components for electronics
Electronics enclosures and assemblies need a coordinated mix of mechanical sealing, EMI/RFI shielding, thermal management, and electrical insulation. Cannon Gasket supplies custom electronics components, including gaskets, shielding seals, thermal pads, and insulator washers, to OEMs in telecom, semiconductor, defense electronics, medical electronics, and consumer hardware.
Where electronics sealing shows up
- EMI/RFI enclosure gaskets
- Display and LCD gaskets
- Board-level shielding
- Electrical insulation washers
- Thin dielectric films
- Flexible circuit insulators
Sealing and Shielding Applications
Electronics work spans several sealing jobs at once. EMI/RFI shielding gaskets use conductive silicone, wire-mesh elastomer, and conductive fluorosilicone to meet FCC, CE, and MIL-STD compliance, while conductive form-in-place gaskets handle board-level shielding. Thermal interface pads built from conductive elastomers and thermal management materials carry heat between components and heat sinks. Electrical isolation comes from insulator washers in Kapton, phenolic, G-10/FR-4, Nomex, and fibre. For environmental sealing of enclosures, silicone, EPDM, and neoprene provide the mechanical seal that keeps moisture and contaminants out.
Materials We Supply for Electronics
Cannon stocks the conductive and dielectric materials that electronics assemblies depend on. Shielding parts come from conductive silicone, conductive fluorosilicone, and wire-mesh-in-elastomer. Insulation and dielectric parts come from Kapton (HN, FN, and CR grades), Mylar, Nomex (410 and variants), phenolic (G-10, FR-4, X, XX, and XXX), and fibre. For mechanical sealing we supply silicone, neoprene, and EPDM, and for thermal management we supply Interface® thermal management materials. Choosing among these depends on attenuation targets, operating temperature, and the dielectric strength the design calls for.
Production and Quality
Cannon runs Class 10,000 (ISO 7) clean room production for semiconductor and medical electronics, with ESD-aware handling for sensitive components. Pad printing adds orientation marks and part numbers directly to parts where assembly requires them. Tooling is matched to the part. Compound die cutting holds tight ID/OD on shielding gaskets, while flash cutting and rotary die cutting handle thin-gauge film washers. All of this runs under ISO 9001 certified systems.